MarketResearchReports.Biz announces addition of new report"
Global Semiconductor Packaging and Assembly Equipment Market
2016-2020"to its database.
About Semiconductor Packaging and Assembly Equipment
For an integrated chip (IC) to
function, it needs to be connected to the package or connected
directly to the printed circuit. This involves dicing, wire bonding,
and die bonding. This entire process is known as semiconductor
packaging and assembly, which is the back-end process of chip
formation. The increasing application of semiconductor ICs across
many segments has increased the demand for semiconductor packaging
and assembly equipment.
Technavios analysts forecast the
global semiconductor packaging and assembly equipment market to grow
at a CAGR of 4.68% during the period 2016-2020.
View Full Report at:
http://www.marketresearchreports.biz/analysis/527337
Covered in this report
The report covers the present
scenario and the growth prospects of the global semiconductor
packaging and assembly equipment market for 2016-2020. To calculate
the market size, the report considers the revenue generated from the
sale of die-level and wafer-level packaging and assembly equipment to
semiconductor manufacturers.
The market is divided into the
following segments based on type:
Die- level packaging and assembly
equipment
Wafer-level packaging and assembly
equipment
Technavio's report, Global
Semiconductor Packaging and Assembly Equipment Market 2016-2020, has
been prepared based on an in-depth market analysis with inputs from
industry experts. The report covers the market landscape and its
growth prospects over the coming years. The report also includes a
discussion of the key vendors operating in this market.
Key vendors
- Applied Materials
- ASMPT
- DISCO
- EVG
- Kulicke and Soffa Industries
- TEL
- Tokyo Seimitsu
Other prominent vendors
- Rudolph Technologies
- SEMES
- Suss Microtec
- Ultratech
- Ulvac Technologies
Market driver : Rising
demand for polymer adhesive wafer bonding equipment
Market challenge :
Fluctuating foreign exchange rates
Market trend : Higher
number of mergers and acquisitions (M&A)
Download Detail Report With Complete TOC at:
http://www.marketresearchreports.biz/sample/sample/527337
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