"
Semiconductor Capital Spending Market in the US 2015-2019 1" is
the latest addition to MarketResearchReports.Biz industry research
reports collection.
Market outlook of the
semiconductor capital spending market in the US
Semiconductors are the basic
component for any electronic component. Semiconductor technology is
continuously growing with emergence of advanced technology. Since the
last decade, the most prominent segment in global semiconductor
industry has been memory, logic, MPU and analog, which made up almost
75% of the total semiconductor demand. Technavio predicts the
semiconductor capital spending market in the US to multiply rapidly
with a CAGR of close to 9% during the forecast period.
The semiconductor
capital spending market in the US
is driven by numerous drivers, of which, the most prominent among of
all is the accelerated capex in memory and foundry segments.
Collectively, memory and foundry represent close to two-third of the
total semiconductor capital spending market. With such accelerated
capital investments on a global scale, the outcome will have a
considerable impact on the semiconductor industry worldwide.
Segmentation of the
semiconductor capital spending market in the US by type
- Wafer fab equipment
- Die-level packaging and assembly equipment
- Automated test equipment
- Wafer-level packaging and assembly equipment
- Others
Wafer fab equipment segment
constitutes the largest share of the overall market, accounting for a
market share of more than 48% in 2014. Wafer fab equipment is mainly
used during the first half of semiconductor's manufacturing process
that makes memory cells and transistors. It covers various
patterning, deposition and cleaning process, till wafer passivation.
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Competitive landscape and
key vendors
The competition in the
semiconductor capital spending market in the US is rigid. And the
main reason for such intense completion is the evolution of
technology. With the pace of technological advancements in the US
market, vendors are involved in substantial capital spending, hence,
the market comprises of players with strong technological
proficiency.
Key vendors in this market
are -
Global Foundries
Intel
Micron
Samsung Electronics
SK Hynix
Other prominent vendors
included in this report are AMD, Analog Devices, Broadcom, Freescale,
Semiconductor, Marvell Technologies, Qualcomm, and Texas Instruments.
Growth drivers, challenges, and
upcoming trends:
Technavio also highlights
various trends affecting the semiconductor capital spending market in
the US, and one such trend is the rise in China's semiconductor
industry. Even though, there are a large number of local
semiconductor components manufacturers in China, more than 80% of the
semiconductor requirements in China is fulfilled by US semiconductor
companies, such as Intel and Global Foundries.
This report provides a number
of factors contributing to the adoption, limitations, and
opportunities of the semiconductor capital spending market in the US.
It also offers an analysis of each factor and an estimation of the
extent to which the factors are likely to impact the overall market
growth.
Key questions answered in
the report include
What will the market size and
the growth rate be in 2019?
What are the key factors
driving the semiconductor capital spending market in the US?
What are the key market trends
impacting the growth of the semiconductor capital spending market in
the US?
What are the challenges to
market growth?
Who are the key vendors in the
semiconductor capital spending market in the US?
What are the market
opportunities and threats faced by the vendors in the semiconductor
capital spending market in the US?
What are the key outcomes of
the five forces analysis of the semiconductor capital spending market
in the US?
Table
of Content :
PART
01: Executive summary
Highlights
PART
02: Scope of the report
Market
overview
Product
offerings
PART
03: Market research methodology
Research
methodology
Economic
indicators
PART
04: Introduction
Key
market highlights
PART
05: Market landscape
Market
overview
Market
size and forecast
Five
forces analysis
PART
06: Market segmentation by type
Wafer
fab equipment
Die-level
packaging and assembly equipment
Automated
test equipment
Wafer-level
packaging and assembly equipment
PART
07: Market Drivers
PART
08: Market drivers and their impacts
PART
09: Market challenges
PART
10: Impact of drivers and challenges
PART
11: Market trends
PART
12: Vendor landscape
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